IC DiamondTM Thermal compound contains 92% micronized synthetic diamond, diamond is truly nature’s thermal super conductor with 500% better conductivity than it’s nearest competitor silver. In the electronics industry, the efficient dissipation of heat is a necessity to manage the ever increasing thermal loads. As a result of the strong covalent bonds between the carbon atoms in a diamond crystal, diamond’s extraordinary conductive properties make it the ideal material for any high stress thermal applications.
Widely recognized and accepted by industry experts, diamond’s exceptional attributes such as its high resistance to thermal shock, high electron mobility, high conductivity, and it chemical inertness make it a suitable material for the dissipation of heat in the semiconductor manufacturing industry.
IC DiamondTM contains micronized synthetic diamond in the highest concentration of diamond in any compound available on the market today. Each single crystal micronized particle has the same extraordinary thermal properties you would find in a larger industrial diamond.